Novel two-step baking process for high-aspect-ratio photolithography with conventional positive thick photoresist

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Publisher
SPIE
Issue Date
1998-09-21
Language
English
Citation

Proceedings of the 1998 Conference on Materials and Device Characterization in Micromachining, pp.316 - 325

URI
http://hdl.handle.net/10203/117538
Appears in Collection
EE-Conference Papers(학술회의논문)RIMS Conference Papers
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