Investigation of low cost flip chip under bump metallization (UBM) systems on Cu pads
- Publisher
- IEEE
- Issue Date
- 2001-05-29
- Language
- English
- Citation
51st Electronic Components and Technology Conference, pp.790 - 795
- ISSN
- 0569-5503
- Appears in Collection
- MS-Conference Papers(학술회의논문)
- Files in This Item
Items in DSpace are protected by copyright, with all rights reserved, unless otherwise indicated.