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College of Engineering(공과대학)School of Mechanical and Aerospace Engineering(기계항공공학부)Dept. of Mechanical Engineering(기계공학과)ME-Conference Papers(학술회의논문)

The Effect of Anisotropic Conductive Films Adhesion on the Bending Reliability of Chip-in-Flex Packages for Wearable Electronics Applications

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Kim, Ji Hye / Lee, Tae Ik / Kim, Taek Sooresearcher / Paik, Kyung Wookresearcher
Publisher
Electronic Components and Technology Conference
Issue Date
2016-06-01
Language
English
Citation

66th Electronic Components and Technology Conference, pp.1583 - 1591

URI
http://hdl.handle.net/10203/216397
Appears in Collection
ME-Conference Papers(학술회의논문)MS-Conference Papers(학술회의논문)
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