標題: 軟體測試過程演化之探討-以半導體產業A公司為例
The evolution of software testing process-Example for A company in the semiconductor industry
作者: 江佳玲
Chiang, Chia-Ling
楊千
Yang, Chyan
管理學院資訊管理學程
關鍵字: 軟體測試;系統測試;回歸測試;系統整合測試;自動化測試;Software test;System test;Regression test;System integration test;Automated test
公開日期: 2011
摘要: 隨著半導體製造方法朝著高密度及自動化生產的方向前進,且製造步驟增加,現在不只是要求速度也要求製造品質,所以軟體測試在其中扮演相當重要的角色,半導體產業在台灣已經有幾十年的歷史,其中的軟體系統不斷改變演進,軟體測試也伴隨著不斷成長,而這些軟體測試的成長是否能增加效能,世面上的測試軟體種類、方法繁多,如何找到適合公司內部軟體的測試,如何從複雜的系統中挑選出適合的種類。並且如何以較少的測試數目,測到最多的程式錯誤,唯有不斷透過演化來增加測試效率。 針對研究主題“軟體測試過程演化之探討-以半導體產業A公司為例”本研究採取個案研究法,試圖藉由個案的深度訪談並藉由實際導入的過程,探究個案公司導入軟體測試的歷程與現況從中了解組織內部成長了解組織的需求及效益,並且從組織歷史中能預測未來能避免不需要的錯誤提高生產效益,並從中尋求軟體測試的演化策略。本研究發現,產業越來越重視產品品質,客戶願意花大錢來換取產品品質,因此軟體測試的確是未來的趨勢,對半導體尤其以精準導向的晶圓代工業來說,更能提高其生產品質、效率。對軟體測試帶來預期效益,善用產業相關資源及經驗,方能以最少的成本獲得最佳效益。
Due to the semiconductor manufacturing method is oriented to high density and automation advances, in addition the increase of steps in the manufacture, at the present not only require the speed also demand quality. Therefore, the software testing plays a quite important role. Does the evolution of software testing technique can increase the performance? There are many software testing types, and a lot of methods. How to find the appropriate testing tools for the company’s internal software testing? How to select the suitable kind from the complicated system? How to minimize the software testing to capture the most software mistake? For research topics The evolution of software testing process-Example for A company in the semiconductor industry”. This Case Study is used in depth interviews to document the evolution of software testing in the case company. Customer pay for their quality products and the company must have a capable software testing to ensure its product quality. We found that the organizational arrangement of testing staff from vendor to contractor, from contractor to regular employees to contribute to the positive testing performance.
URI: http://140.113.39.130/cdrfb3/record/nctu/#GT079964507
http://hdl.handle.net/11536/50750
顯示於類別:畢業論文