In-situ TEM study of thermal-stress induced dislocations in a Cu thin film on a 
SiNx coated Si-substracte

Dehm, G.; Arzt, E.

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In-situ TEM study of thermal-stress induced dislocations in a Cu thin film on a SiN_x coated Si-substracte

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Dehm, G.
Former Dept. Micro/Nanomechanics of Thin Films and Biological Systems, Max Planck Institute for Intelligent Systems, Max Planck Society;

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Arzt, E.
Former Dept. Micro/Nanomechanics of Thin Films and Biological Systems, Max Planck Institute for Intelligent Systems, Max Planck Society;
Universität Stuttgart, Institut für Metallkunde;

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Dehm, G., & Arzt, E. (2000). In-situ TEM study of thermal-stress induced dislocations in a Cu thin film on a SiN_x coated Si-substracte. In J. Gemperlova, & I. Vavra (Eds.), Proceedings of the 12th European Congress on Electron Microscopy. Vol. 2: Physical Sciences (pp. 523-524). Czechoslovak Society for Electron Microscopy.

Cite as: https://hdl.handle.net/11858/00-001M-0000-0010-3776-4

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