| Title: | An investigation of low temperature transient liquid phase bonding of silver, gold, and copper |
| Author: | Roman, John W. (John William) |
| Advisor: | Thomas W. Eagar. |
| Department: | Massachusetts Institute of Technology. Dept. of Materials Science and Engineering |
| Description: |
Thesis (M.S.)--Massachusetts Institute of Technology, Dept. of Materials Science and Engineering, 1991. Includes bibliographical references (leaves 110-112) |
| URI: | http://hdl.handle.net/1721.1/13483 |
| Issue Date: | 1991 |
| Publisher: | Massachusetts Institute of Technology |
| Keywords: | Materials Science and Engineering |
| Files | Size | Format |
|---|---|---|
| Preview, non-printable (open to all) | 7.793Mb | application/pdf |
| Full printable version (MIT only) | 7.793Mb | application/pdf |