Title:
Mechanisms Underlying the Unstable Contact Resistance of Conductive Adhesives
Mechanisms Underlying the Unstable Contact Resistance of Conductive Adhesives
Author(s)
Wong, C. P.
Lu, Daoqiang
Tong, Quinn K.
Lu, Daoqiang
Tong, Quinn K.
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Abstract
One critical obstacle of current conductive adhesives
is their unstable contact resistance with nonnoble metal finished
components during high temperature and humidity aging. It is
commonly accepted that metal oxide formation at the interface
between the conductive adhesive and the nonnoble metal surface
is responsible for the contact resistance shift. Two different mechanisms,
simple oxidation and galvanic corrosion, both can cause
metal oxide formation, but no prior work has been conducted to
confirm which mechanism is the dominant one. Therefore, this
study is aimed at identifying the main mechanism for the metal
oxide formation and the unstable contact resistance phenomenon
of current conductive adhesives. A contact resistance test device,
which consists of metal wire segments and conductive adhesive
dots, is specially designed for this study. Adhesives and metal
wires are carefully selected and experiments are systematically
designed. Based on the results of this systematic study, galvanic
corrosion has been identified as the underlying mechanism for
the metal oxide formation and for the observed unstable contact
resistance phenomenon of conductive adhesives.
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Date Issued
1999-07
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192713 bytes
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Text
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Article