Title:
Wire-bonding Overview and Packaging Toolsets at Georgia Tech IEN
Wire-bonding Overview and Packaging Toolsets at Georgia Tech IEN
Author(s)
White, Christopher P.
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Abstract
The shared user labs within the Institute for Electronics and Nanotechnology at Georgia Tech include an electronics packaging toolset. A brief overview of assembly and interconnection toolsets and technologies available within IEN will be presented. A process overview on wire-bonding capabilities will also be discussed.
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Date Issued
2020-06-11
Extent
61:29 minutes
Resource Type
Moving Image
Resource Subtype
Presentation