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Connecting surface-mounted electronic elements with amber strand metal-clad conductive fibers by reflow soldering

Author
Organization
Abstract
Electronic yarns contain electronic components which are fully embedded into the conductive yarn’s structure before manufacturing smart textile garments or fabrics. To accept comprehensively the electronic textiles, it is essential to integrate the electronic components into/onto the conductive textile yarn without compromising the quality of the textile substrate. Therefore, one of the solutions is to create flexible and stretchable conductive yarn that contains a small surface-mounted electronic component embedded in the fibers of the conductive yarn. The purpose of this research work is to manufacture and subsequently evaluate the physical and electromechanical properties of amber strand (Toyobo’s p-phenylene benzobisoxazole fiber zylon) yarns with embedded surface-mounted device components. Using a benchtop reflow-soldering machine, the surface-mounted device component was successfully inserted into the amber strand conductive yarn. Then the developed electronic yarn was coated using thermoplastic polyurethane for encapsulation purposes. Furthermore, reliability tests of the electrical and mechanical properties of the electronic yarn (tensile strain and washing) were carried out. From the results it can be seen that the developed thermoplastic polyurethane encapsulated electronic yarn had a tensile strength of 37.38 N with a 4.1 mm extension. Furthermore, the relationship between the strain and washing action on the electrical resistance of the developed electronic yarn was experimentally investigated. The analytical finding shows that mechanical stress and laundry washing had a significant influence on the electrical resistance of the electronic yarn.
Keywords
Polymers and Plastics, Chemical Engineering (miscellaneous), integration, surface-mounted device, conductive fibers, low temperature solder paste, reflow soldering, electronic yarn, smart textile, wearable electronics, TEXTILES, YARNS

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Citation

Please use this url to cite or link to this publication:

MLA
Ahmmed, Abdella Simegnaw, et al. “Connecting Surface-Mounted Electronic Elements with Amber Strand Metal-Clad Conductive Fibers by Reflow Soldering.” TEXTILE RESEARCH JOURNAL, vol. 93, no. 17–18, 2023, doi:10.1177/00405175231167864.
APA
Ahmmed, A. S., Malengier, B., Getnet, M., & Van Langenhove, L. (2023). Connecting surface-mounted electronic elements with amber strand metal-clad conductive fibers by reflow soldering. TEXTILE RESEARCH JOURNAL, 93(17–18). https://doi.org/10.1177/00405175231167864
Chicago author-date
Ahmmed, Abdella Simegnaw, Benny Malengier, Melkie Getnet, and Lieva Van Langenhove. 2023. “Connecting Surface-Mounted Electronic Elements with Amber Strand Metal-Clad Conductive Fibers by Reflow Soldering.” TEXTILE RESEARCH JOURNAL 93 (17–18). https://doi.org/10.1177/00405175231167864.
Chicago author-date (all authors)
Ahmmed, Abdella Simegnaw, Benny Malengier, Melkie Getnet, and Lieva Van Langenhove. 2023. “Connecting Surface-Mounted Electronic Elements with Amber Strand Metal-Clad Conductive Fibers by Reflow Soldering.” TEXTILE RESEARCH JOURNAL 93 (17–18). doi:10.1177/00405175231167864.
Vancouver
1.
Ahmmed AS, Malengier B, Getnet M, Van Langenhove L. Connecting surface-mounted electronic elements with amber strand metal-clad conductive fibers by reflow soldering. TEXTILE RESEARCH JOURNAL. 2023;93(17–18).
IEEE
[1]
A. S. Ahmmed, B. Malengier, M. Getnet, and L. Van Langenhove, “Connecting surface-mounted electronic elements with amber strand metal-clad conductive fibers by reflow soldering,” TEXTILE RESEARCH JOURNAL, vol. 93, no. 17–18, 2023.
@article{01H07CK54P9RVSRBR14Q7JSEN5,
  abstract     = {{Electronic yarns contain electronic components which are fully embedded into the conductive yarn’s structure before manufacturing smart textile garments or fabrics. To accept comprehensively the electronic textiles, it is essential to integrate the electronic components into/onto the conductive textile yarn without compromising the quality of the textile substrate. Therefore, one of the solutions is to create flexible and stretchable conductive yarn that contains a small surface-mounted electronic component embedded in the fibers of the conductive yarn. The purpose of this research work is to manufacture and subsequently evaluate the physical and electromechanical properties of amber strand (Toyobo’s p-phenylene benzobisoxazole fiber zylon) yarns with embedded surface-mounted device components. Using a benchtop reflow-soldering machine, the surface-mounted device component was successfully inserted into the amber strand conductive yarn. Then the developed electronic yarn was coated using thermoplastic polyurethane for encapsulation purposes. Furthermore, reliability tests of the electrical and mechanical properties of the electronic yarn (tensile strain and washing) were carried out. From the results it can be seen that the developed thermoplastic polyurethane encapsulated electronic yarn had a tensile strength of 37.38 N with a 4.1 mm extension. Furthermore, the relationship between the strain and washing action on the electrical resistance of the developed electronic yarn was experimentally investigated. The analytical finding shows that mechanical stress and laundry washing had a significant influence on the electrical resistance of the electronic yarn. }},
  articleno    = {{1167864}},
  author       = {{Ahmmed, Abdella Simegnaw and Malengier, Benny and Getnet, Melkie and Van Langenhove, Lieva}},
  issn         = {{0040-5175}},
  journal      = {{TEXTILE RESEARCH JOURNAL}},
  keywords     = {{Polymers and Plastics,Chemical Engineering (miscellaneous),integration,surface-mounted device,conductive fibers,low temperature solder paste,reflow soldering,electronic yarn,smart textile,wearable electronics,TEXTILES,YARNS}},
  language     = {{eng}},
  number       = {{17-18}},
  pages        = {{12}},
  title        = {{Connecting surface-mounted electronic elements with amber strand metal-clad conductive fibers by reflow soldering}},
  url          = {{http://doi.org/10.1177/00405175231167864}},
  volume       = {{93}},
  year         = {{2023}},
}

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