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Novel interconnect methodologies for ultra-thin chips on foils

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Abstract
Reliable interconnection technology is key to the realization of reliable hybrid microelectronic systems that combine printed electronics and silicon technology. Flexible hybrid electronic systems-in-foil (SiF) that are typically suited for roll-to-roll (R2R) manufacturing place additional requirements and demands on interconnects. In this paper, three novel interconnection methodologies for SiF are compared for a novel face-up integration approach for ultra-thin chip on foil. Laser scribing, inkjet printing and laser-induced forward transfer (LIFT) are the technologies compared with each other, as well as with electroplating, a standard technology widely used in the electronics industry. The comparison is based on experimental investigation into via filling, interconnect deposition, electrical conductivity and interconnect reliability. The selection of an interconnection technology for practical implementation is the key outcome of this paper.

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Citation

Please use this url to cite or link to this publication:

MLA
Sridhar, A., et al. “Novel Interconnect Methodologies for Ultra-Thin Chips on Foils.” 2012 IEEE 62nd Electronic Components and Technology Conference, IEEE, 2012, pp. 238–44.
APA
Sridhar, A., Cauwe, M., Fledderus, H., Kusters, R., & van den Brand, J. (2012). Novel interconnect methodologies for ultra-thin chips on foils. 2012 IEEE 62nd Electronic Components and Technology Conference, 238–244. Piscataway, NJ, USA: IEEE.
Chicago author-date
Sridhar, A, Maarten Cauwe, H Fledderus, R Kusters, and J van den Brand. 2012. “Novel Interconnect Methodologies for Ultra-Thin Chips on Foils.” In 2012 IEEE 62nd Electronic Components and Technology Conference, 238–44. Piscataway, NJ, USA: IEEE.
Chicago author-date (all authors)
Sridhar, A, Maarten Cauwe, H Fledderus, R Kusters, and J van den Brand. 2012. “Novel Interconnect Methodologies for Ultra-Thin Chips on Foils.” In 2012 IEEE 62nd Electronic Components and Technology Conference, 238–244. Piscataway, NJ, USA: IEEE.
Vancouver
1.
Sridhar A, Cauwe M, Fledderus H, Kusters R, van den Brand J. Novel interconnect methodologies for ultra-thin chips on foils. In: 2012 IEEE 62nd Electronic Components and Technology Conference. Piscataway, NJ, USA: IEEE; 2012. p. 238–44.
IEEE
[1]
A. Sridhar, M. Cauwe, H. Fledderus, R. Kusters, and J. van den Brand, “Novel interconnect methodologies for ultra-thin chips on foils,” in 2012 IEEE 62nd Electronic Components and Technology Conference, San Diego, CA, USA, 2012, pp. 238–244.
@inproceedings{2974740,
  abstract     = {{Reliable interconnection technology is key to the realization of reliable hybrid microelectronic systems that combine printed electronics and silicon technology. Flexible hybrid electronic systems-in-foil (SiF) that are typically suited for roll-to-roll (R2R) manufacturing place additional requirements and demands on interconnects. In this paper, three novel interconnection methodologies for SiF are compared for a novel face-up integration approach for ultra-thin chip on foil. Laser scribing, inkjet printing and laser-induced forward transfer (LIFT) are the technologies compared with each other, as well as with electroplating, a standard technology widely used in the electronics industry. The comparison is based on experimental investigation into via filling, interconnect deposition, electrical conductivity and interconnect reliability. The selection of an interconnection technology for practical implementation is the key outcome of this paper.}},
  author       = {{Sridhar, A and Cauwe, Maarten and Fledderus, H and Kusters, R and van den Brand, J}},
  booktitle    = {{2012 IEEE 62nd Electronic Components and Technology Conference}},
  isbn         = {{9781467319652}},
  language     = {{eng}},
  location     = {{San Diego, CA, USA}},
  pages        = {{238--244}},
  publisher    = {{IEEE}},
  title        = {{Novel interconnect methodologies for ultra-thin chips on foils}},
  year         = {{2012}},
}

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