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A die-to-wafer bonding approach to photonics integration (poster)

Günther Roelkens (UGent) , Dries Van Thourhout (UGent) and Roel Baets (UGent)
(2007) ePIXnet Winter School '07, Applications of Photonic Integration.
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Citation

Please use this url to cite or link to this publication:

MLA
Roelkens, Günther, et al. “A Die-to-Wafer Bonding Approach to Photonics Integration (Poster).” EPIXnet Winter School ’07, Applications of Photonic Integration, 2007, p. 48, doi:1854/9308.
APA
Roelkens, G., Van Thourhout, D., & Baets, R. (2007). A die-to-wafer bonding approach to photonics integration (poster). EPIXnet Winter School ’07, Applications of Photonic Integration, 48. https://doi.org/1854/9308
Chicago author-date
Roelkens, Günther, Dries Van Thourhout, and Roel Baets. 2007. “A Die-to-Wafer Bonding Approach to Photonics Integration (Poster).” In EPIXnet Winter School ’07, Applications of Photonic Integration, 48. https://doi.org/1854/9308.
Chicago author-date (all authors)
Roelkens, Günther, Dries Van Thourhout, and Roel Baets. 2007. “A Die-to-Wafer Bonding Approach to Photonics Integration (Poster).” In EPIXnet Winter School ’07, Applications of Photonic Integration, 48. doi:1854/9308.
Vancouver
1.
Roelkens G, Van Thourhout D, Baets R. A die-to-wafer bonding approach to photonics integration (poster). In: ePIXnet Winter School ’07, Applications of Photonic Integration. 2007. p. 48.
IEEE
[1]
G. Roelkens, D. Van Thourhout, and R. Baets, “A die-to-wafer bonding approach to photonics integration (poster),” in ePIXnet Winter School ’07, Applications of Photonic Integration, 2007, p. 48.
@inproceedings{388526,
  author       = {{Roelkens, Günther and Van Thourhout, Dries and Baets, Roel}},
  booktitle    = {{ePIXnet Winter School '07, Applications of Photonic Integration}},
  language     = {{und}},
  pages        = {{Poster nr. 48-Poster nr. 48}},
  title        = {{A die-to-wafer bonding approach to photonics integration (poster)}},
  url          = {{http://doi.org/1854/9308}},
  year         = {{2007}},
}
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