Advanced search
3 files | 13.86 MB Add to list

Creating wires and devices using dangling bond states on semiconductor surfaces: a theoretical perspective

Mark Saeys (UGent)
(2014) p.8-8
Author
Organization

Downloads

  • (...).pdf
    • full text
    • |
    • UGent only
    • |
    • PDF
    • |
    • 13.58 MB
  • (...).pdf
    • full text
    • |
    • UGent only
    • |
    • PDF
    • |
    • 83.14 KB
  • (...).pdf
    • full text
    • |
    • UGent only
    • |
    • PDF
    • |
    • 196.31 KB

Citation

Please use this url to cite or link to this publication:

MLA
Saeys, Mark. Creating Wires and Devices Using Dangling Bond States on Semiconductor Surfaces: A Theoretical Perspective. 2014, pp. 8–8.
APA
Saeys, M. (2014). Creating wires and devices using dangling bond states on semiconductor surfaces: a theoretical perspective. 8–8.
Chicago author-date
Saeys, Mark. 2014. “Creating Wires and Devices Using Dangling Bond States on Semiconductor Surfaces: A Theoretical Perspective.” In , 8–8.
Chicago author-date (all authors)
Saeys, Mark. 2014. “Creating Wires and Devices Using Dangling Bond States on Semiconductor Surfaces: A Theoretical Perspective.” In , 8–8.
Vancouver
1.
Saeys M. Creating wires and devices using dangling bond states on semiconductor surfaces: a theoretical perspective. In 2014. p. 8–8.
IEEE
[1]
M. Saeys, “Creating wires and devices using dangling bond states on semiconductor surfaces: a theoretical perspective,” presented at the International Workshop on Atomic Scale Wires - AtWires, Kraków, Poland, 2014, pp. 8–8.
@inproceedings{5890152,
  author       = {{Saeys, Mark}},
  language     = {{eng}},
  location     = {{Kraków, Poland}},
  pages        = {{8--8}},
  title        = {{Creating wires and devices using dangling bond states on semiconductor surfaces: a theoretical perspective}},
  year         = {{2014}},
}