Creating wires and devices using dangling bond states on semiconductor surfaces: a theoretical perspective
(2014)
p.8-8
- Author
- Mark Saeys (UGent)
- Organization
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Citation
Please use this url to cite or link to this publication: http://hdl.handle.net/1854/LU-5890152
- MLA
- Saeys, Mark. Creating Wires and Devices Using Dangling Bond States on Semiconductor Surfaces: A Theoretical Perspective. 2014, pp. 8–8.
- APA
- Saeys, M. (2014). Creating wires and devices using dangling bond states on semiconductor surfaces: a theoretical perspective. 8–8.
- Chicago author-date
- Saeys, Mark. 2014. “Creating Wires and Devices Using Dangling Bond States on Semiconductor Surfaces: A Theoretical Perspective.” In , 8–8.
- Chicago author-date (all authors)
- Saeys, Mark. 2014. “Creating Wires and Devices Using Dangling Bond States on Semiconductor Surfaces: A Theoretical Perspective.” In , 8–8.
- Vancouver
- 1.Saeys M. Creating wires and devices using dangling bond states on semiconductor surfaces: a theoretical perspective. In 2014. p. 8–8.
- IEEE
- [1]M. Saeys, “Creating wires and devices using dangling bond states on semiconductor surfaces: a theoretical perspective,” presented at the International Workshop on Atomic Scale Wires - AtWires, Kraków, Poland, 2014, pp. 8–8.
@inproceedings{5890152, author = {{Saeys, Mark}}, language = {{eng}}, location = {{Kraków, Poland}}, pages = {{8--8}}, title = {{Creating wires and devices using dangling bond states on semiconductor surfaces: a theoretical perspective}}, year = {{2014}}, }