850 nm hybrid vertical cavity laser integration for on-chip silicon photonics light sources
- Author
- Günther Roelkens (UGent) , Emanuel P. Haglund, Sulakshna Kumari (UGent) , Erik Haglund, Johan S. Gustavsson, Roel Baets (UGent) and Anders Larsson
- Organization
- Project
- Abstract
- The realization of 850 rim hybrid III-V/dielectric VCSELs is reported in order to realize low power consumption integrated light sources for SiN waveguide circuits, which find applications both in short-reach optical communication and optical sensors.
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Citation
Please use this url to cite or link to this publication: http://hdl.handle.net/1854/LU-8539433
- MLA
- Roelkens, Günther, et al. “850 Nm Hybrid Vertical Cavity Laser Integration for On-Chip Silicon Photonics Light Sources.” 2017 OPTICAL FIBER COMMUNICATIONS CONFERENCE AND EXHIBITION (OFC), Ieee, 2017, pp. 1–3.
- APA
- Roelkens, G., Haglund, E. P., Kumari, S., Haglund, E., Gustavsson, J. S., Baets, R., & Larsson, A. (2017). 850 nm hybrid vertical cavity laser integration for on-chip silicon photonics light sources. 2017 OPTICAL FIBER COMMUNICATIONS CONFERENCE AND EXHIBITION (OFC), 1–3. New york: Ieee.
- Chicago author-date
- Roelkens, Günther, Emanuel P. Haglund, Sulakshna Kumari, Erik Haglund, Johan S. Gustavsson, Roel Baets, and Anders Larsson. 2017. “850 Nm Hybrid Vertical Cavity Laser Integration for On-Chip Silicon Photonics Light Sources.” In 2017 OPTICAL FIBER COMMUNICATIONS CONFERENCE AND EXHIBITION (OFC), 1–3. New york: Ieee.
- Chicago author-date (all authors)
- Roelkens, Günther, Emanuel P. Haglund, Sulakshna Kumari, Erik Haglund, Johan S. Gustavsson, Roel Baets, and Anders Larsson. 2017. “850 Nm Hybrid Vertical Cavity Laser Integration for On-Chip Silicon Photonics Light Sources.” In 2017 OPTICAL FIBER COMMUNICATIONS CONFERENCE AND EXHIBITION (OFC), 1–3. New york: Ieee.
- Vancouver
- 1.Roelkens G, Haglund EP, Kumari S, Haglund E, Gustavsson JS, Baets R, et al. 850 nm hybrid vertical cavity laser integration for on-chip silicon photonics light sources. In: 2017 OPTICAL FIBER COMMUNICATIONS CONFERENCE AND EXHIBITION (OFC). New york: Ieee; 2017. p. 1–3.
- IEEE
- [1]G. Roelkens et al., “850 nm hybrid vertical cavity laser integration for on-chip silicon photonics light sources,” in 2017 OPTICAL FIBER COMMUNICATIONS CONFERENCE AND EXHIBITION (OFC), Los Angeles, CA, 2017, pp. 1–3.
@inproceedings{8539433, abstract = {{The realization of 850 rim hybrid III-V/dielectric VCSELs is reported in order to realize low power consumption integrated light sources for SiN waveguide circuits, which find applications both in short-reach optical communication and optical sensors.}}, articleno = {{paper W3E.6}}, author = {{Roelkens, Günther and Haglund, Emanuel P. and Kumari, Sulakshna and Haglund, Erik and Gustavsson, Johan S. and Baets, Roel and Larsson, Anders}}, booktitle = {{2017 OPTICAL FIBER COMMUNICATIONS CONFERENCE AND EXHIBITION (OFC)}}, isbn = {{978-1-943580-23-1}}, language = {{eng}}, location = {{Los Angeles, CA}}, pages = {{paper W3E.6:1--paper W3E.6:3}}, publisher = {{Ieee}}, title = {{850 nm hybrid vertical cavity laser integration for on-chip silicon photonics light sources}}, year = {{2017}}, }