- Author
- Maarten Cauwe (UGent) and Johan De Baets (UGent)
- Organization
- Abstract
- The objective of this study was to investigate the suitability of embedding passive components in printed circuit boards for space applications. To achieve this goal, an overview of available technologies for component embedding was provided along with their strongpoints and challenges with respect to space projects. The direct embedding of passive components in printed circuit boards was evaluated in depth to determine its performance and reliability. Characterization and reliability investigation were performed using a dedicated test board containing embedded resistors and capacitors. A Spacecraft Interface Module (SIM) board, part of the Advanced Data and Power Management System developed by QinetiQ Space, was redesigned using embedded passive components to demonstrate the capabilities of the technology. Procurement of components for embedding and other logistic aspects were evaluated in this exercise. The outcome of this study aids ESA in determining which projects can benefit from this technology and what procedures for procurement and validation need to be followed.
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Citation
Please use this url to cite or link to this publication: http://hdl.handle.net/1854/LU-8544827
- MLA
- Cauwe, Maarten, and Johan De Baets. Passive Component Embedding in Printed Circuit Boards for Space Applications. 2017, pp. 1–22.
- APA
- Cauwe, M., & De Baets, J. (2017). Passive component embedding in printed circuit boards for space applications. 1–22.
- Chicago author-date
- Cauwe, Maarten, and Johan De Baets. 2017. “Passive Component Embedding in Printed Circuit Boards for Space Applications.” In , 1–22.
- Chicago author-date (all authors)
- Cauwe, Maarten, and Johan De Baets. 2017. “Passive Component Embedding in Printed Circuit Boards for Space Applications.” In , 1–22.
- Vancouver
- 1.Cauwe M, De Baets J. Passive component embedding in printed circuit boards for space applications. In 2017. p. 1–22.
- IEEE
- [1]M. Cauwe and J. De Baets, “Passive component embedding in printed circuit boards for space applications,” presented at the 1st Passive Components Networking Symposium, Brno, Czech republic, 2017, pp. 1–22.
@inproceedings{8544827, abstract = {{The objective of this study was to investigate the suitability of embedding passive components in printed circuit boards for space applications. To achieve this goal, an overview of available technologies for component embedding was provided along with their strongpoints and challenges with respect to space projects. The direct embedding of passive components in printed circuit boards was evaluated in depth to determine its performance and reliability. Characterization and reliability investigation were performed using a dedicated test board containing embedded resistors and capacitors. A Spacecraft Interface Module (SIM) board, part of the Advanced Data and Power Management System developed by QinetiQ Space, was redesigned using embedded passive components to demonstrate the capabilities of the technology. Procurement of components for embedding and other logistic aspects were evaluated in this exercise. The outcome of this study aids ESA in determining which projects can benefit from this technology and what procedures for procurement and validation need to be followed.}}, author = {{Cauwe, Maarten and De Baets, Johan}}, language = {{eng}}, location = {{Brno, Czech republic}}, pages = {{1--22}}, title = {{Passive component embedding in printed circuit boards for space applications}}, year = {{2017}}, }