Heterogeneous integration in silicon photonics through micro-transfer-printing
- Author
- Jing Zhang (UGent) , Grigorij Muliuk (UGent) , Jeroen Goyvaerts (UGent) , Bahawal Haq, Alexandros Liles (UGent) , Sulakshna Kumari (UGent) , Joan Juvert (UGent) , Camiel Op de Beeck (UGent) , Bart Kuyken (UGent) , Joris Van Campenhout, Guy Lepage, Peter Verheyen, Agnieszka Gocalinkska, Emanuele Pelucchi, Brian Corbett, Antonio Jose Trindade, Chris Bower and Günther Roelkens (UGent)
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- Project
- Abstract
- Micro-transfer-printing enables the intimate integration of a wide range of opto-electronic micro-components on a silicon photonics platform. This technique allows for wafer-scale integration in a massively parallel manner with high alignment accuracy, high throughput and high yield, therefore leading to a cost reduction of complex photonic integrated circuits.
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Citation
Please use this url to cite or link to this publication: http://hdl.handle.net/1854/LU-8637841
- MLA
- Zhang, Jing, et al. “Heterogeneous Integration in Silicon Photonics through Micro-Transfer-Printing.” 2019 24th Microoptics Conference (MOC), IEEE, 2019, pp. 64–65, doi:10.23919/MOC46630.2019.8982786.
- APA
- Zhang, J., Muliuk, G., Goyvaerts, J., Haq, B., Liles, A., Kumari, S., … Roelkens, G. (2019). Heterogeneous integration in silicon photonics through micro-transfer-printing. 2019 24th Microoptics Conference (MOC), 64–65. https://doi.org/10.23919/MOC46630.2019.8982786
- Chicago author-date
- Zhang, Jing, Grigorij Muliuk, Jeroen Goyvaerts, Bahawal Haq, Alexandros Liles, Sulakshna Kumari, Joan Juvert, et al. 2019. “Heterogeneous Integration in Silicon Photonics through Micro-Transfer-Printing.” In 2019 24th Microoptics Conference (MOC), 64–65. IEEE. https://doi.org/10.23919/MOC46630.2019.8982786.
- Chicago author-date (all authors)
- Zhang, Jing, Grigorij Muliuk, Jeroen Goyvaerts, Bahawal Haq, Alexandros Liles, Sulakshna Kumari, Joan Juvert, Camiel Op de Beeck, Bart Kuyken, Joris Van Campenhout, Guy Lepage, Peter Verheyen, Agnieszka Gocalinkska, Emanuele Pelucchi, Brian Corbett, Antonio Jose Trindade, Chris Bower, and Günther Roelkens. 2019. “Heterogeneous Integration in Silicon Photonics through Micro-Transfer-Printing.” In 2019 24th Microoptics Conference (MOC), 64–65. IEEE. doi:10.23919/MOC46630.2019.8982786.
- Vancouver
- 1.Zhang J, Muliuk G, Goyvaerts J, Haq B, Liles A, Kumari S, et al. Heterogeneous integration in silicon photonics through micro-transfer-printing. In: 2019 24th Microoptics Conference (MOC). IEEE; 2019. p. 64–5.
- IEEE
- [1]J. Zhang et al., “Heterogeneous integration in silicon photonics through micro-transfer-printing,” in 2019 24th Microoptics Conference (MOC), Toyama, Japan, 2019, pp. 64–65.
@inproceedings{8637841, abstract = {{Micro-transfer-printing enables the intimate integration of a wide range of opto-electronic micro-components on a silicon photonics platform. This technique allows for wafer-scale integration in a massively parallel manner with high alignment accuracy, high throughput and high yield, therefore leading to a cost reduction of complex photonic integrated circuits.}}, articleno = {{paper C4}}, author = {{Zhang, Jing and Muliuk, Grigorij and Goyvaerts, Jeroen and Haq, Bahawal and Liles, Alexandros and Kumari, Sulakshna and Juvert, Joan and Op de Beeck, Camiel and Kuyken, Bart and Van Campenhout, Joris and Lepage, Guy and Verheyen, Peter and Gocalinkska, Agnieszka and Pelucchi, Emanuele and Corbett, Brian and Trindade, Antonio Jose and Bower, Chris and Roelkens, Günther}}, booktitle = {{2019 24th Microoptics Conference (MOC)}}, isbn = {{9781728122113}}, language = {{eng}}, location = {{Toyama, Japan}}, pages = {{paper C4:64--paper C4:65}}, publisher = {{IEEE}}, title = {{Heterogeneous integration in silicon photonics through micro-transfer-printing}}, url = {{http://doi.org/10.23919/MOC46630.2019.8982786}}, year = {{2019}}, }
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