III-V-on-Si photonic integrated circuits realized using micro-transfer-printing
- Author
- Jing Zhang (UGent) , Grigorij Muliuk (UGent) , Joan Juvert (UGent) , Sulakshna Kumari (UGent) , Jeroen Goyvaerts (UGent) , Bahawal Haq, Camiel Op de Beeck (UGent) , Bart Kuyken (UGent) , Geert Morthier (UGent) , Dries Van Thourhout (UGent) , Roel Baets (UGent) , Guy Lepage, Peter Verheyen, Joris Van Campenhout, Agnieszka Gocalinska, James O’Callaghan, Emanuele Pelucchi, Kevin Thomas, Brian Corbett, António José Trindade and Günther Roelkens (UGent)
- Organization
- Project
- Abstract
- Silicon photonics (SiPh) enables compact photonic integrated circuits (PICs), showing superior performance for a wide variety of applications. Various optical functions have been demonstrated on this platform that allows for complex and powerful PICs. Nevertheless, laser source integration technologies are not yet as mature, hampering the further cost reduction of the eventual Si photonic systems-on-chip and impeding the expansion of this platform to a broader range of applications. Here, we discuss a promising technology, micro-transfer-printing (mu TP), for the realization of III-V-on-Si PICs. By employing a polydimethylsiloxane elastomeric stamp, the integration of III-V devices can be realized in a massively parallel manner on a wafer without substantial modifications to the SiPh process flow, leading to a significant cost reduction of the resulting III-V-on-Si PICs. This paper summarizes some of the recent developments in the use of mu TP technology for realizing the integration of III-V photodiodes and lasers on Si PICs. (C) 2019 Author(s).
- Keywords
- WAVE-GUIDE, HYBRID INTEGRATION, SILICON, LASER
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Please use this url to cite or link to this publication: http://hdl.handle.net/1854/LU-8637852
- MLA
- Zhang, Jing, et al. “III-V-on-Si Photonic Integrated Circuits Realized Using Micro-Transfer-Printing.” APL PHOTONICS, vol. 4, no. 11, 2019, doi:10.1063/1.5120004.
- APA
- Zhang, J., Muliuk, G., Juvert, J., Kumari, S., Goyvaerts, J., Haq, B., … Roelkens, G. (2019). III-V-on-Si photonic integrated circuits realized using micro-transfer-printing. APL PHOTONICS, 4(11). https://doi.org/10.1063/1.5120004
- Chicago author-date
- Zhang, Jing, Grigorij Muliuk, Joan Juvert, Sulakshna Kumari, Jeroen Goyvaerts, Bahawal Haq, Camiel Op de Beeck, et al. 2019. “III-V-on-Si Photonic Integrated Circuits Realized Using Micro-Transfer-Printing.” APL PHOTONICS 4 (11). https://doi.org/10.1063/1.5120004.
- Chicago author-date (all authors)
- Zhang, Jing, Grigorij Muliuk, Joan Juvert, Sulakshna Kumari, Jeroen Goyvaerts, Bahawal Haq, Camiel Op de Beeck, Bart Kuyken, Geert Morthier, Dries Van Thourhout, Roel Baets, Guy Lepage, Peter Verheyen, Joris Van Campenhout, Agnieszka Gocalinska, James O’Callaghan, Emanuele Pelucchi, Kevin Thomas, Brian Corbett, António José Trindade, and Günther Roelkens. 2019. “III-V-on-Si Photonic Integrated Circuits Realized Using Micro-Transfer-Printing.” APL PHOTONICS 4 (11). doi:10.1063/1.5120004.
- Vancouver
- 1.Zhang J, Muliuk G, Juvert J, Kumari S, Goyvaerts J, Haq B, et al. III-V-on-Si photonic integrated circuits realized using micro-transfer-printing. APL PHOTONICS. 2019;4(11).
- IEEE
- [1]J. Zhang et al., “III-V-on-Si photonic integrated circuits realized using micro-transfer-printing,” APL PHOTONICS, vol. 4, no. 11, 2019.
@article{8637852, abstract = {{Silicon photonics (SiPh) enables compact photonic integrated circuits (PICs), showing superior performance for a wide variety of applications. Various optical functions have been demonstrated on this platform that allows for complex and powerful PICs. Nevertheless, laser source integration technologies are not yet as mature, hampering the further cost reduction of the eventual Si photonic systems-on-chip and impeding the expansion of this platform to a broader range of applications. Here, we discuss a promising technology, micro-transfer-printing (mu TP), for the realization of III-V-on-Si PICs. By employing a polydimethylsiloxane elastomeric stamp, the integration of III-V devices can be realized in a massively parallel manner on a wafer without substantial modifications to the SiPh process flow, leading to a significant cost reduction of the resulting III-V-on-Si PICs. This paper summarizes some of the recent developments in the use of mu TP technology for realizing the integration of III-V photodiodes and lasers on Si PICs. (C) 2019 Author(s).}}, articleno = {{110803}}, author = {{Zhang, Jing and Muliuk, Grigorij and Juvert, Joan and Kumari, Sulakshna and Goyvaerts, Jeroen and Haq, Bahawal and Op de Beeck, Camiel and Kuyken, Bart and Morthier, Geert and Van Thourhout, Dries and Baets, Roel and Lepage, Guy and Verheyen, Peter and Van Campenhout, Joris and Gocalinska, Agnieszka and O’Callaghan, James and Pelucchi, Emanuele and Thomas, Kevin and Corbett, Brian and Trindade, António José and Roelkens, Günther}}, issn = {{2378-0967}}, journal = {{APL PHOTONICS}}, keywords = {{WAVE-GUIDE,HYBRID INTEGRATION,SILICON,LASER}}, language = {{eng}}, number = {{11}}, pages = {{10}}, title = {{III-V-on-Si photonic integrated circuits realized using micro-transfer-printing}}, url = {{http://doi.org/10.1063/1.5120004}}, volume = {{4}}, year = {{2019}}, }
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