The diploma thesis deals with heat dissipation analysis of different printed circuit board materials in different configuration. Several FR4 material versions are used: basic version without vias and also 3 additional versions with different numbers of vias. In addition, there are also CEM3 and two versions of insulated metal substrate (IMS) boards: copper and on aluminium base plate. Thermal behaviour is analysed in many ways, as it is used in praxis during development of printed circuit boards for lamps for
automotive industry in company Hella Saturnus Slovenija d.o.o. At first all boards are simulated in three different simulation programs, with the purpose of board analysis and comparison of simulation results between the programs. Next step is the thermal camera analysis to find out where the hot spots are and to define points for thermocouple measurement. Last part of analysis is a thermocouple measurement on physical parts at different thermal loads with the purpose to check the behaviour at
different thermal stresses and determination of applicability in specific applications. Also some other versions of printed circuit boards with a focus on cooling are presented.
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