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Thermal resistances of solder-boss/potting compound combinationsFormulas, which can be used as a design tool, are derived to calculate the thermal resistance of solder-boss/potting compound combinations, for different depths of a solder boss, in electronic cordwood modules. Since the solder boss is the heat source, its shape and position will affect the thermal resistance of the surrounding potting compound.
Document ID
19680000157
Acquisition Source
Legacy CDMS
Document Type
Other - NASA Tech Brief
Authors
Veilleux, E. D.
Date Acquired
August 4, 2013
Publication Date
May 1, 1968
Subject Category
Electronic Components And Circuits
Report/Patent Number
MSC-12074
Accession Number
68B10157
Distribution Limits
Public
Copyright
Work of the US Gov. Public Use Permitted.

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