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Modular packaging technique for combining integrated circuits and discrete componentsTechnique for packaging electronic modules interconnects integrated circuits and discrete components by means of beryllium-copper strips in a molded diallyphthalate tray. Simple girder-like construction provides ease of assembly, high rigidity, excellent vibration resistance, and good heat dissipation characteristics.
Document ID
19690000442
Acquisition Source
Legacy CDMS
Document Type
Other - NASA Tech Brief
Authors
Lacchia, J. F.
Date Acquired
August 5, 2013
Publication Date
September 1, 1969
Subject Category
Electronic Components And Circuits
Report/Patent Number
GSC-10369
Accession Number
69B10453
Distribution Limits
Public
Copyright
Work of the US Gov. Public Use Permitted.

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