NASA Logo

NTRS

NTRS - NASA Technical Reports Server

Collections About News Help Login
Back to Results
Application of diffusion bonding to electronic interconnection of flatpack leadsDiffusion-bonded joints between gold-plated Kovar leads and indium-plated copper circuit pads offer some advantages for electronic circuit packaging. Test results show that consistent high strength bonds stronger than the copper circuit foil are achieved by parallel-gap bonding at relatively low power settings. The bonds are basically formed by the alloying of the gold, indium and copper at the bond interface. Other low melting metals such as tin can also be used; however, tin does not offer the ease of bonding that results in consistent separation of the copper foil during pull testing. The investigation was conducted in three parts consisting of: (1) an evaluation of the physical strength of resulting bonds at ambient and elevated temperature, (2) a metallurgical analysis of bonds using scanning electron microscopy and nondispersive X-ray analysis, and (3) evaluation and development of various schemes for multiple lead flatpack bonding.
Document ID
19730024696
Acquisition Source
Legacy CDMS
Document Type
Contractor Report (CR)
Authors
Korb, R. W. (Hughes Aircraft Co. Fullerton, CA, United States)
Lardenoit, V. F. (Hughes Aircraft Co. Fullerton, CA, United States)
Date Acquired
September 2, 2013
Publication Date
July 1, 1973
Subject Category
Materials, Metallic
Report/Patent Number
FR-73-01-580
NASA-CR-124460
Accession Number
73N33429
Funding Number(s)
CONTRACT_GRANT: NAS8-28269
Distribution Limits
Public
Copyright
Work of the US Gov. Public Use Permitted.

Related Records

There are no records associated with this record.
No Preview Available