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Cryogenic/high temperature structural adhesivesResults are described of the work performed to develop a structural adhesive system which possesses useful properties over a 20K (-423 F) to 589 K (600 F) temperature range. Adhesives systems based on polyimide, polyphenylquinoxaline polyquinoxaline, polybenzothiazole and polybenzimidazole polymers first were screened for suitability. Detailed evaluation of two polyimide adhesive sytems, Br34/FM34 and P4/A5F or P4A/A5FA, and one polyphenylquinoxaline adhesive system, PPQ II (IMW), then was performed. Property information was generated over the full temperature range for shear strength, stressed and unstressed thermal aging, thermal shock and coefficient of thermal expansion. Both polyimide adhesive systems were identified as being capable of providing structural adhesive joints for cryogenic/high temperature service.
Document ID
19740006121
Acquisition Source
Legacy CDMS
Document Type
Contractor Report (CR)
Authors
Vaughan, R. W. (TRW Systems Group Redondo Beach, CA, United States)
Sheppard, C. H. (TRW Systems Group Redondo Beach, CA, United States)
Date Acquired
September 3, 2013
Publication Date
January 1, 1974
Subject Category
Materials, Nonmetallic
Report/Patent Number
TRW-22898-6012-TU-00
NASA-CR-134465
Accession Number
74N14234
Funding Number(s)
CONTRACT_GRANT: NAS3-16780
Distribution Limits
Public
Copyright
Work of the US Gov. Public Use Permitted.

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