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Discrete component bonding and thick film materials studyThe results are summarized of an investigation of discrete component bonding reliability and a fundamental study of new thick film resistor materials. The component bonding study examined several types of solder bonded components with some processing variable studies to determine their influence upon bonding reliability. The bonding reliability was assessed using the thermal cycle: 15 minutes at room temperature, 15 minutes at +125 C 15 minutes at room temperature, and 15 minutes at -55 C. The thick film resistor materials examined were of the transition metal oxide-phosphate glass family with several elemental metal additions of the same transition metal. These studies were conducted by preparing a paste of the subject composition, printing, drying, and firing using both air and reducing atmospheres. The resulting resistors were examined for adherence, resistance, thermal coefficient of resistance, and voltage coefficient of resistance.
Document ID
19760003230
Acquisition Source
Legacy CDMS
Document Type
Contractor Report (CR)
Authors
Kinser, D. L. (Vanderbilt Univ. Nashville, TN, United States)
Date Acquired
September 3, 2013
Publication Date
September 17, 1975
Subject Category
Nonmetallic Materials
Report/Patent Number
NASA-CR-144001
Accession Number
76N10318
Funding Number(s)
CONTRACT_GRANT: NAS8-30883
Distribution Limits
Public
Copyright
Work of the US Gov. Public Use Permitted.

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