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The development of low temperature curing adhesivesAn approach for the development of a practical low temperature (293 K-311 K/68 F-100 F) curing adhesive system based on a family of amide/ester resins was studied and demonstrated. The work was conducted on resin optimization and adhesive compounding studies. An improved preparative method was demonstrated which involved the reaction of an amine-alcohol precursor, in a DMF solution with acid chloride. Experimental studies indicated that an adhesive formulation containing aluminum powder provided the best performance when used in conjunction with a commercial primer.
Document ID
19760005098
Acquisition Source
Legacy CDMS
Document Type
Contractor Report (CR)
Authors
Green, H. E.
(TRW Systems Group Redondo Beach, CA, United States)
Sutherland, J. D.
(TRW Systems Group Redondo Beach, CA, United States)
Hom, J. M.
(TRW Systems Group Redondo Beach, CA, United States)
Sheppard, C. H.
(TRW Systems Group Redondo Beach, CA, United States)
Date Acquired
September 3, 2013
Publication Date
December 1, 1975
Subject Category
Nonmetallic Materials
Report/Patent Number
NASA-CR-132751
TRW-26415-6015-RU-00
Accession Number
76N12186
Funding Number(s)
CONTRACT_GRANT: NAS1-13203
Distribution Limits
Public
Copyright
Work of the US Gov. Public Use Permitted.
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