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Slicing of silicon into sheet material. Silicon sheet growth development for the large area silicon sheet task of the low cost silicon solar array projectFabrication of a prototype large capacity multiple blade slurry saw is considered. Design of the bladehead which will tension up to 1000 blades, and cut a 45 cm long silicon ingot as large as 12 cm in diameter is given. The large blade tensioning force of 270,000 kg is applied through two bolts acting on a pair of scissor toggles, significantly reducing operator set-up time. Tests with an upside-down cutting technique resulted in 100% wafering yields and the highest wafer accuracy yet experienced with MS slicing. Variations in oil and abrasives resulted only in degraded slicing results. A technique of continuous abrasive slurry separation to remove silicon debris is described.
Document ID
19780016686
Acquisition Source
Legacy CDMS
Document Type
Contractor Report (CR)
Authors
Holden, S. C. (Varian Associates Lexington, MA, United States)
Fleming, J. R. (Varian Associates Lexington, MA, United States)
Date Acquired
September 3, 2013
Publication Date
January 12, 1978
Subject Category
Energy Production And Conversion
Report/Patent Number
ERDA/JPL-954374-77/4
QR-7
NASA-CR-157080
Accession Number
78N24629
Funding Number(s)
CONTRACT_GRANT: NAS7-100
CONTRACT_GRANT: JPL-954374
Distribution Limits
Public
Copyright
Work of the US Gov. Public Use Permitted.

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