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The Establishment of a Production-ready Manufacturing Process Utilizing Thin Silicon Substrates for Solar CellsDuring the months of February and March, work towards the goals of the contract were started as scheduled. The first shipment of thin substrates were received and wafer processing was initiated. The objective of the contract is to investigate, develop and characterize the methods for establishing a production-ready manufacturing process which utilizes thin silicon substrates for solar cells. The thin substrates to be manufactured are three inches diameter, p-type Czochralski wafers of approximately 1 Omega cm resistivity. The wafers are prepared by sawing directly to thickness of 8 mils and 5 mils. To ensure removal of residual saw damage, most substrates are chemically etched to final thicknesses of 7 mils and 4 mils. The thin substrates are used to fabricate solar cells by standard processing techniques.
Document ID
19790015352
Acquisition Source
Legacy CDMS
Document Type
Contractor Report (CR)
Authors
Pryor, R. A. (Motorola, Inc. Phoenix, AZ, United States)
Date Acquired
September 4, 2013
Publication Date
January 1, 1979
Subject Category
Energy Production And Conversion
Report/Patent Number
QTR-1
DOE/JPL-955328-79/1
NASA-CR-158566
REPT-2364/1
Accession Number
79N23523
Funding Number(s)
PROJECT: PROJ. 2364
OTHER: JPL-955328
Distribution Limits
Public
Copyright
Work of the US Gov. Public Use Permitted.

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