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The establishment of a production-ready manufacturing process utilizing thin silicon substrates for solar cellsThree inch diameter Czochralski silicon substrates sliced directly to 5 mil, 8 mil, and 27 mil thicknesses with wire saw techniques were procured. Processing sequences incorporating either diffusion or ion implantation technologies were employed to produce n+p or n+pp+ solar cell structures. These cells were evaluated for performance, ease of fabrication, and cost effectiveness. It was determined that the use of 7 mil or even 4 mil wafers would provide near term cost reductions for solar cell manufacturers.
Document ID
19810015081
Acquisition Source
Legacy CDMS
Document Type
Contractor Report (CR)
Authors
Pryor, R. A. (Motorola, Inc. Phoenix, AZ, United States)
Date Acquired
September 4, 2013
Publication Date
October 1, 1980
Subject Category
Energy Production And Conversion
Report/Patent Number
DOE/JPL-955328-80/4
DRL-99
DRD-SE-5
NASA-CR-164327
MOTOROLA-2364/4
JPL-9950-528
Accession Number
81N23615
Funding Number(s)
PROJECT: JPL PROJ. 2364
OTHER: JPL-955328
Distribution Limits
Public
Copyright
Work of the US Gov. Public Use Permitted.

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