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Influence of fluids on the abrasion of silicon by diamondSilicon wafers ((100)-p-type) were abraded at room temperature in acetone, absolute ethanol and water by a pyramid diamond and the resulting groove depth was measured as a function of normal force on the diamond and the absorbed fluids, while all other experimental conditions were held constant. The groove depth rates are in the ratio of 1:2:3 for water, absolute ethanol, and acetone, respectively, for a constant normal force. The groove depth rate is lower when the normal force is decreased. The silicon abraded in the presence of water was chipped as expected for a classical brittle material while the surfaces abraded in the other two fluids showed ductile ploughing as the main mechanism for silicon removal.
Document ID
19820015783
Acquisition Source
Legacy CDMS
Document Type
Conference Paper
Authors
Danyluk, S. (Illinois Univ. Chicago, IL, United States)
Date Acquired
August 10, 2013
Publication Date
February 1, 1982
Publication Information
Publication: JPL Proc. of the Low-Cost Solar Array Wafering Workshop
Subject Category
Energy Production And Conversion
Accession Number
82N23659
Distribution Limits
Public
Copyright
Work of the US Gov. Public Use Permitted.

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IDRelationTitle19820015774Collected WorksProceedings of the Low-Cost Solar Array Wafering Workshop
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