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The uses of Man-Made diamond in wafering applicationsThe continuing, rapid growth of the semiconductor industry requires the involvement of several specialized industries in the development of special products geared toward the unique requirements of this new industry. A specialized manufactured diamond to meet various material removal needs was discussed. The area of silicon wafer slicing has presented yet anothr challenge and it is met most effectively. The history, operation, and performance of Man-Made diamond and particularly as applied to silicon wafer slicing is discussed. Product development is underway to come up with a diamond specifically for sawing silicon wafers on an electroplated blade.
Document ID
19820015784
Acquisition Source
Legacy CDMS
Document Type
Conference Paper
Authors
Fallon, D. B.
(General Electric Co. Worthington, OH, United States)
Date Acquired
August 10, 2013
Publication Date
February 1, 1982
Publication Information
Publication: JPL Proc. of the Low-Cost Solar Array Wafering Workshop
Subject Category
Energy Production And Conversion
Accession Number
82N23660
Distribution Limits
Public
Copyright
Work of the US Gov. Public Use Permitted.
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