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Plasma polymerized high energy density dielectric films for capacitorsHigh energy density polymeric dielectric films were prepared by plasma polymerization of a variety of gaseous monomers. This technique gives thin, reproducible, pinhole free, conformable, adherent, and insoluble coatings and overcomes the processing problems found in the preparation of thin films with bulk polymers. Thus, devices are prepared completely in a vacuum environment. The plasma polymerized films prepared all showed dielectric strengths of greater than 1000 kV/cm and in some cases values of greater than 4000 kV/cm were observed. The dielectric loss of all films was generally less than 1% at frequencies below 10 kHz, but this value increased at higher frequencies. All films were self healing. The dielectric strength was a function of the polymerization technique, whereas the dielectric constant varied with the structure of the starting material. Because of the thin films used (thickness in the submicron range) surface smoothness of the metal electrodes was found to be critical in obtaining high dielectric strengths. High dielectric strength graft copolymers were also prepared. Plasma polymerized ethane was found to be thermally stable up to 150 C in the presence of air and 250 C in the absence of air. No glass transitions were observed for this material.
Document ID
19840005242
Acquisition Source
Legacy CDMS
Document Type
Contractor Report (CR)
Authors
Yamagishi, F. G. (Hughes Research Labs. Malibu, CA, United States)
Date Acquired
September 4, 2013
Publication Date
October 1, 1983
Subject Category
Nonmetallic Materials
Report/Patent Number
NAS 1.26:168233
NASA-CR-168233
Accession Number
84N13310
Funding Number(s)
CONTRACT_GRANT: NAS3-22828
Distribution Limits
Public
Copyright
Work of the US Gov. Public Use Permitted.

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