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High temperature resistant polyimide from tetra ester, diamine, diester and N-arylnadimideThe invention described relates to improved polyimide resins which are noted for their high thermal and oxidative stability, high strength at elevated temperatures and which exhibit many other outstanding physical and chemical properties, especially useful in high temperature applications. The polyimides are prepared by the reaction, with application of heat of a mixture of monomers comprising: (1) a dialkyl or tetraalkyl ester of an aromatic tetracarboxylic acid, (2) and aromatic diamine, (3) a monoalkyl or dialky ester of a dicarboxylic acid, and (4) a N-arylnadimide such as N-phenylnadimide. Polyimides of monomers (1), (2) and (3) are known.
Document ID
19860009986
Acquisition Source
Legacy CDMS
Document Type
Other - Patent
Authors
Pater, R. H. (NASA Lewis Research Center Cleveland, OH, United States)
Date Acquired
August 12, 2013
Publication Date
December 24, 1985
Subject Category
Nonmetallic Materials
Accession Number
86N19457
Distribution Limits
Public
Copyright
Work of the US Gov. Public Use Permitted.
Patent
NASA-CASE-LEW-13864-1|US-PATENT-4,560,742
Patent Application
US-PATENT-APPL-SN-434087

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