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Dielectric cure monitoring of the 55A filament wound case resinStudies were conducted to correlate data from dielectric cure monitoring of 55A filament would case resins using the Micromet System II with differential scanning calorimetry and resin strength tests. Strength tests for resin bonding at various time intervals and DSC are standard accepted techniques for monitoriong resin cure cycles. They are time consuming, destructive, and non-continuous. The Micromet System II will yield reliable information on degree of cure and other parameters, which should allow better quality control on filament wound case resin cure.
Document ID
19860015067
Acquisition Source
Legacy CDMS
Document Type
Conference Paper
Authors
Mcnutt, R. C.
(Athens Coll. AL, United States)
Date Acquired
August 12, 2013
Publication Date
January 1, 1986
Publication Information
Publication: NASA. Marshall Space Flight Center Research Reports: 1985 NASA(ASEE Summer Faculty Fellowship Program
Subject Category
Nonmetallic Materials
Accession Number
86N24538
Distribution Limits
Public
Copyright
Work of the US Gov. Public Use Permitted.
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