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Thermal/vacuum vs. thermal atmospheric testing of space flight electronic assembliesFor space flight hardware, the thermal vacuum environmental test is the best test of a system's flight worthiness. Substituting an atmospheric pressure thermal test for a thermal/vacuum test can effectively reduce piece part temperatures by 20 C or more, even for low power density designs. Similar reductions in test effectiveness can also result from improper assembly level T/V test boundary conditions. The net result of these changes may reduce the effective test temperatures to the point where there is zero or negative margin over the flight thermal environment.
Document ID
19910009841
Acquisition Source
Legacy CDMS
Document Type
Conference Paper
Authors
Gibbel, Mark
(Gibbel Corp. Palos Verdes Estates, CA, United States)
Date Acquired
September 6, 2013
Publication Date
November 1, 1990
Publication Information
Publication: NASA, Goddard Space Flight Center, 16th Space Simulation Conference Confirming Spaceworthiness Into the Next Millennium
Subject Category
Electronics And Electrical Engineering
Accession Number
91N19154
Distribution Limits
Public
Copyright
Work of the US Gov. Public Use Permitted.
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