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A process for preparing an ultra-thin, adhesiveless, multi-layered, patterned polymer substrateA process for preparing an ultra-thin, adhesiveless, multi-layered, patterned polymer substrate is disclosed. The process may be used to prepare both rigid and flexible cables and circuit boards. A substrate is provided and a polymeric solution comprising a self-bonding, soluble polymer and a solvent is applied to the substrate. Next, the polymer solution is dried to form a polymer coated substrate. The polymer coated substrate is metallized and patterned. At least one additional coating of the polymeric solution is applied to the metallized, patterned, polymer coated substrate and the steps of metallizing and patterning are repeated. Lastly, a cover coat is applied. When preparing a flexible cable and flexible circuit board, the polymer coating is removed from the substrate.
Document ID
19960016930
Acquisition Source
Langley Research Center
Document Type
Other - Patent Application
Authors
Bryant, Robert G. (NASA Langley Research Center Hampton, VA United States)
Kruse, Nancy H. M. (NASA Langley Research Center Hampton, VA United States)
Fox, Robert L. (NASA Langley Research Center Hampton, VA United States)
Tran, Sang Q. (NASA Langley Research Center Hampton, VA United States)
Date Acquired
August 17, 2013
Publication Date
September 12, 1995
Subject Category
Nonmetallic Materials
Report/Patent Number
NASA-CASE-LAR-15387-1
NAS 1.71:LAR-15387-1
Accession Number
96N22537
Distribution Limits
Public
Copyright
Work of the US Gov. Public Use Permitted.

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