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NASA Electronic Parts and Packaging ProgramNEPP program objectives are to: (1) Access the reliability of newly available electronic parts and packaging technologies for usage on NASA projects through validations, assessments, and characterizations, and the development of test methods/tools; (2)Expedite infusion paths for advanced (emerging) electronic parts and packaging technologies by evaluations of readiness for manufacturability and project usage consideration; (3) Provide NASA projects with technology selection, application, and validation guidelines for electronic parts and packaging hardware and processes; nd (4) Retain and disseminate electronic parts and packaging quality assurance, reliability validations, tools, and availability information to the NASA community.
Document ID
20000054542
Acquisition Source
Jet Propulsion Laboratory
Document Type
Other
Authors
Kayali, Sammy
(Jet Propulsion Lab., California Inst. of Tech. Pasadena, CA United States)
Date Acquired
September 7, 2013
Publication Date
January 1, 2000
Subject Category
Electronics And Electrical Engineering
Distribution Limits
Public
Copyright
Work of the US Gov. Public Use Permitted.
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