NASA Logo

NTRS

NTRS - NASA Technical Reports Server

Back to Results
High Temperature Transfer Molding ResinsHigh temperature resins containing phenylethynyl groups that are processable by transfer molding have been prepared. These phenylethynyl containing oligomers were prepared from aromatic diamines containing phenylethynyl groups and various ratios of phthalic anhydride and 4-phenylethynlphthalic anhydride in glacial acetic acid to form a mixture of imide compounds in one step. This synthetic approach is advantageous since the products are a mixture of compounds and consequently exhibit a relatively low melting temperature. In addition, these materials exhibit low melt viscosities which are stable for several hours at 210-275 C, and since the thermal reaction of the phenylethynyl group does not occur to any appreciable extent at temperatures below 300 C, these materials have a broad processing window. Upon thermal cure at approximately 300-350 C, the phenylethynyl groups react to provide a crosslinked resin system. These new materials exhibit excellent properties and are potentially useful as adhesives, coatings, films, moldings and composite matrices.
Document ID
20010008195
Acquisition Source
Langley Research Center
Document Type
Other - Patent
Authors
Connell, John W.
(NASA Langley Research Center Hampton, VA United States)
Smith, Joseph G., Jr.
(NASA Langley Research Center Hampton, VA United States)
Hergenrother, Paul M.
(NASA Langley Research Center Hampton, VA United States)
Date Acquired
September 7, 2013
Publication Date
September 26, 2000
Subject Category
Nonmetallic Materials
Distribution Limits
Public
Copyright
Work of the US Gov. Public Use Permitted.
Patent
US-Patent-6,124,035|NASA-Case-LAR-15544-1
Patent Application
US-Patent-Appl-SN-310686
No Preview Available