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Influence of Cooling Hole Geometry and Material Conductivity on the Thermal Response of Cooled Silicon Nitride PlateTo complement the effectiveness of ceramic materials and the applicability to turbine engine applications, a parametric study using the finite element method was carried out. This study conducted thorough analyses of a thermal-barrier-coated silicon nitride (Si3N4) plate specimen with cooling channels, where its thermal conductivity was verified in an attempt to minimize the thermal stresses and reach an optimal rate of stress. The thermal stress profile was generated for specimens with circular and square cooling channels. Lower stresses were reported for a higher magnitude of thermal conductivity and in particular for the circular cooling channel arrangement. Contour plots for the stresses and the temperature are presented and discussed.
Document ID
20030003720
Acquisition Source
Glenn Research Center
Document Type
Technical Memorandum (TM)
Authors
Abdul-Aziz, Ali
(Cleveland State Univ. Cleveland, OH United States)
Bhatt, Ramakrishna T.
(Army Research Lab. Cleveland, OH United States)
Girgis, Morris
(Central State Univ. Wilberforce, OH United States)
Date Acquired
September 7, 2013
Publication Date
November 1, 2002
Subject Category
Structural Mechanics
Report/Patent Number
NASA/TM-2002-211688
E-13417
NAS 1.15:211688
Meeting Information
Meeting: 26th Annual International Conference on Advanced Ceramics and Composites
Location: Cocoa Beach, FL
Country: United States
Start Date: January 13, 2002
End Date: January 18, 2002
Sponsors: American Ceramic Society
Funding Number(s)
PROJECT: RTOP 708-31-13
Distribution Limits
Public
Copyright
Public Use Permitted.
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