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High T(sub g) Polymides for Resin Transfer MoldingA series of new polyimide resins with low melt viscosities and high glass transition temperatures (T(sub g)'s) of 340-350 C were developed for resin transfer molding (RTM) applications. The viscosities of these polyimide resins, based on 2,3,3'4'-Biphenyltetracarboxylic Dianhydride (a-BPDA), are in the range of 10-30 poise. The composites were fabricated successfully at 260-280 C with a pot life of 30-60 minutes by the RTM process. The viscosity profiles of the polyimide resins and the mechanical properties of the polyimide carbon fiber composites will be discussed.
Document ID
20050080714
Acquisition Source
Glenn Research Center
Document Type
Preprint (Draft being sent to journal)
Authors
Chuang, Kathy C. (NASA Glenn Research Center Cleveland, OH, United States)
Criss, Jim M., Jr.
Mintz, Eric A. (Clark-Atlanta Univ. GA, United States)
Shonkwiler, Brian (Clark-Atlanta Univ. GA, United States)
Scheiman, Daniel A. (QSS Group, Inc. Cleveland, OH, United States)
Nguyen, Baochau (Ohio Aerospace Inst. Cleveland, OH, United States)
McCorkle, Linda S. (Ohio Aerospace Inst. Cleveland, OH, United States)
Hardy-Green, DeNise (Akron Univ. Akron, OH, United States)
Date Acquired
September 7, 2013
Publication Date
January 1, 2005
Subject Category
Nonmetallic Materials
Funding Number(s)
WBS: WBS-22-714-30-01
Distribution Limits
Public
Copyright
Public Use Permitted.

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