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High-Performance, Radiation-Hardened Electronics for Space EnvironmentsThe Radiation Hardened Electronics for Space Environments (RHESE) project endeavors to advance the current state-of-the-art in high-performance, radiation-hardened electronics and processors, ensuring successful performance of space systems required to operate within extreme radiation and temperature environments. Because RHESE is a project within the Exploration Technology Development Program (ETDP), RHESE's primary customers will be the human and robotic missions being developed by NASA's Exploration Systems Mission Directorate (ESMD) in partial fulfillment of the Vision for Space Exploration. Benefits are also anticipated for NASA's science missions to planetary and deep-space destinations. As a technology development effort, RHESE provides a broad-scoped, full spectrum of approaches to environmentally harden space electronics, including new materials, advanced design processes, reconfigurable hardware techniques, and software modeling of the radiation environment. The RHESE sub-project tasks are: SelfReconfigurable Electronics for Extreme Environments, Radiation Effects Predictive Modeling, Radiation Hardened Memory, Single Event Effects (SEE) Immune Reconfigurable Field Programmable Gate Array (FPGA) (SIRF), Radiation Hardening by Software, Radiation Hardened High Performance Processors (HPP), Reconfigurable Computing, Low Temperature Tolerant MEMS by Design, and Silicon-Germanium (SiGe) Integrated Electronics for Extreme Environments. These nine sub-project tasks are managed by technical leads as located across five different NASA field centers, including Ames Research Center, Goddard Space Flight Center, the Jet Propulsion Laboratory, Langley Research Center, and Marshall Space Flight Center. The overall RHESE integrated project management responsibility resides with NASA's Marshall Space Flight Center (MSFC). Initial technology development emphasis within RHESE focuses on the hardening of Field Programmable Gate Arrays (FPGA)s and Field Programmable Analog Arrays (FPAA)s for use in reconfigurable architectures. As these component/chip level technologies mature, the RHESE project emphasis shifts to focus on efforts encompassing total processor hardening techniques and board-level electronic reconfiguration techniques featuring spare and interface modularity. This phased approach to distributing emphasis between technology developments provides hardened FPGA/FPAAs for early mission infusion, then migrates to hardened, board-level, high speed processors with associated memory elements and high density storage for the longer duration missions encountered for Lunar Outpost and Mars Exploration occurring later in the Constellation schedule.
Document ID
20070032045
Acquisition Source
Marshall Space Flight Center
Document Type
Conference Paper
Authors
Keys, Andrew S. (NASA Marshall Space Flight Center Huntsville, AL, United States)
Watson, Michael D. (NASA Marshall Space Flight Center Huntsville, AL, United States)
Frazier, Donald O. (NASA Marshall Space Flight Center Huntsville, AL, United States)
Adams, James H. (NASA Marshall Space Flight Center Huntsville, AL, United States)
Johnson, Michael A. (NASA Goddard Space Flight Center Greenbelt, MD, United States)
Kolawa, Elizabeth A. (Jet Propulsion Lab., California Inst. of Tech. Pasadena, CA, United States)
Date Acquired
August 23, 2013
Publication Date
June 25, 2007
Subject Category
Space Radiation
Meeting Information
Meeting: International Planetary Probes Workshop-5
Location: Boudeaux
Country: France
Start Date: June 25, 2007
End Date: June 29, 2007
Sponsors: NASA Headquarters, European Space Agency
Distribution Limits
Public
Copyright
Work of the US Gov. Public Use Permitted.

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