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A Comparative Study of Inspection Techniques for Array PackagesThis viewgraph presentation reviews the inspection techniques for Column Grid Array (CGA) packages. The CGA is a method of chip scale packaging using high temperature solder columns to attach part to board. It is becoming more popular over other techniques (i.e. quad flat pack (QFP) or ball grid array (BGA)). However there are environmental stresses and workmanship challenges that require good inspection techniques for these packages.
Document ID
20080017496
Acquisition Source
Goddard Space Flight Center
Document Type
Conference Paper
Authors
Mohammed, Jelila (NASA Goddard Space Flight Center Greenbelt, MD, United States)
Green, Christopher (NASA Goddard Space Flight Center Greenbelt, MD, United States)
Date Acquired
August 24, 2013
Publication Date
April 28, 2008
Subject Category
Electronics And Electrical Engineering
Meeting Information
Meeting: Military, Aerospace, Space and Homeland Security (MASH): Packaging Issues and Applications
Location: Linthicum Heights, MD
Country: United States
Start Date: April 29, 2008
End Date: April 30, 2008
Sponsors: International Microelectronics and Packaging Society
Distribution Limits
Public
Copyright
Work of the US Gov. Public Use Permitted.

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