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Apparatus and methods for packaging integrated circuit chips with antenna modules providing closed electromagnetic environment for integrated antennasApparatus and methods are provided for packaging IC chips together with integrated antenna modules designed to provide a closed EM (electromagnetic) environment for antenna radiators, thereby allowing antennas to be designed independent from the packaging technology.
Document ID
20080025652
Acquisition Source
Glenn Research Center
Document Type
Other - Patent
Authors
Gaucher, Brian P.
Grzyb, Janusz
Liu, Duixian
Pfeiffer, Ullrich R.
Date Acquired
August 24, 2013
Publication Date
May 13, 2008
Subject Category
Electronics And Electrical Engineering
Funding Number(s)
CONTRACT_GRANT: NAS3-03070
Distribution Limits
Public
Copyright
Work of the US Gov. Public Use Permitted.
Patent
US-Patent-7,372,408
Patent Application
US-Patent-Appl-SN-11/332,737

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