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Terahertz Mapping of Microstructure and Thickness VariationsA noncontact method has been devised for mapping or imaging spatial variations in the thickness and microstructure of a layer of a dielectric material. The method involves (1) placement of the dielectric material on a metal substrate, (2) through-the-thickness pulse-echo measurements by use of electromagnetic waves in the terahertz frequency range with a raster scan in a plane parallel to the substrate surface that do not require coupling of any kind, and (3) appropriate processing of the digitized measurement data.
Document ID
20100001349
Acquisition Source
Glenn Research Center
Document Type
Other - NASA Tech Brief
External Source(s)
http://www.embeddedtechmag.com/component/content/article/6575
Authors
Roth, Donald J. (NASA Glenn Research Center Cleveland, OH, United States)
Seebo, Jeffrey P. (NASA Glenn Research Center Cleveland, OH, United States)
Winfree, William P. (NASA Glenn Research Center Cleveland, OH, United States)
Date Acquired
August 25, 2013
Publication Date
January 1, 2010
Publication Information
Publication: NASA Tech Briefs, January 2010
Subject Category
Instrumentation And Photography
Report/Patent Number
LEW-18254-1
Distribution Limits
Public
Copyright
Public Use Permitted.

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