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Binding Causes of Printed Wiring Assemblies with Card-LoksA document discusses a study that presents the first documented extraction loads, both nominal and worst case, and presents the first comprehensive evaluation of extraction techniques, methodologies, and tool requirements relating to extracting printed wiring assemblies (PWAs) with Card-Loks during EVA (extra vehicular activity). This task was performed for the first time during HST (Hubble Space Telescope) Servicing Mission 4. With impending missions to Mars and to the Moon relying on an astronaut's abilities to perform repair and servicing tasks during EVAs, this study provides some insight into what challenges may be encountered during a repair/replacement of a PWA with Card-Loks. Extraction techniques presented in this study could be applicable to other PWA geometries with similar locking devices. Ground-based extractions also benefit from the techniques and extraction tool requirements presented in the study. The findings highlight techniques that work reliably, efficiently, and provide design requirements for tools necessary for extracting PWAs with Card-Loks on ground.
Document ID
20120013255
Acquisition Source
Goddard Space Flight Center
Document Type
Other - NASA Tech Brief
External Source(s)
http://www.techbriefs.com/component/content/article/14219
Authors
Raven, Hans (ATK Space United States)
Eisenhower, Kevin (Alliant Techsystems, Inc. United States)
Date Acquired
August 26, 2013
Publication Date
August 1, 2012
Publication Information
Publication: NASA Tech Briefs, August 2012
Subject Category
Engineering (General)
Report/Patent Number
GSC-16160-1
Distribution Limits
Public
Copyright
Public Use Permitted.

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IDRelationTitle20120013225Collected WorksNASA Tech Briefs, August 2012
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