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Alumina Based 500 C Electronic Packaging Systems and Future DevelopmentNASA space and aeronautical missions for probing the inner solar planets as well as for in situ monitoring and control of next-generation aeronautical engines require high-temperature environment operable sensors and electronics. A 96% aluminum oxide and Au thick-film metallization based packaging system including chip-level packages, printed circuit board, and edge-connector is in development for high temperature SiC electronics. An electronic packaging system based on this material system was successfully tested and demonstrated with SiC electronics at 500 C for over 10,000 hours in laboratory conditions previously. In addition to the tests in laboratory environments, this packaging system has more recently been tested with a SiC junction field effect transistor (JFET) on low earth orbit through the NASA Materials on the International Space Station Experiment 7 (MISSE7). A SiC JFET with a packaging system composed of a 96% alumina chip-level package and an alumina printed circuit board mounted on a data acquisition circuit board was launched as a part of the MISSE7 suite to International Space Station via a Shuttle mission and tested on the orbit for eighteen months. A summary of results of tests in both laboratory and space environments will be presented. The future development of alumina based high temperature packaging using co-fired material systems for improved performance at high temperature and more feasible mass production will also be discussed.
Document ID
20120016721
Acquisition Source
Glenn Research Center
Document Type
Presentation
Authors
Chen, Liang-Yu (Ohio Aerospace Inst. Cleveland, OH, United States)
Date Acquired
August 26, 2013
Publication Date
October 9, 2012
Subject Category
Electronics And Electrical Engineering
Report/Patent Number
E-18539
ARC-E-DAA-TN6080
Meeting Information
Meeting: 2012 Electronics Packaging Symposium - Technology
Location: Niskayuna, NY
Country: United States
Start Date: October 9, 2012
End Date: October 10, 2012
Sponsors: Birmingham Univ., General Electric Co.
Funding Number(s)
WBS: WBS 284848.02.04.03.02.02
CONTRACT_GRANT: NNC07BA13B
Distribution Limits
Public
Copyright
Public Use Permitted.

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