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Silicon Heat Pipe ArrayImproved methods of heat dissipation are required for modern, high-power density electronic systems. As increased functionality is progressively compacted into decreasing volumes, this need will be exacerbated. High-performance chip power is predicted to increase monotonically and rapidly with time. Systems utilizing these chips are currently reliant upon decades of old cooling technology. Heat pipes offer a solution to this problem. Heat pipes are passive, self-contained, two-phase heat dissipation devices. Heat conducted into the device through a wick structure converts the working fluid into a vapor, which then releases the heat via condensation after being transported away from the heat source. Heat pipes have high thermal conductivities, are inexpensive, and have been utilized in previous space missions. However, the cylindrical geometry of commercial heat pipes is a poor fit to the planar geometries of microelectronic assemblies, the copper that commercial heat pipes are typically constructed of is a poor CTE (coefficient of thermal expansion) match to the semiconductor die utilized in these assemblies, and the functionality and reliability of heat pipes in general is strongly dependent on the orientation of the assembly with respect to the gravity vector. What is needed is a planar, semiconductor-based heat pipe array that can be used for cooling of generic MCM (multichip module) assemblies that can also function in all orientations. Such a structure would not only have applications in the cooling of space electronics, but would have commercial applications as well (e.g. cooling of microprocessors and high-power laser diodes). This technology is an improvement over existing heat pipe designs due to the finer porosity of the wick, which enhances capillary pumping pressure, resulting in greater effective thermal conductivity and performance in any orientation with respect to the gravity vector. In addition, it is constructed of silicon, and thus is better suited for the cooling of semiconductor devices.
Document ID
20130009823
Acquisition Source
Jet Propulsion Laboratory
Document Type
Other - NASA Tech Brief
External Source(s)
http://www.techbriefs.com/component/content/article/15662
Authors
Yee, Karl Y. (California Inst. of Tech. Pasadena, CA, United States)
Ganapathi, Gani B. (California Inst. of Tech. Pasadena, CA, United States)
Sunada, Eric T. (California Inst. of Tech. Pasadena, CA, United States)
Bae, Youngsam (California Inst. of Tech. Pasadena, CA, United States)
Miller, Jennifer R. (California Inst. of Tech. Pasadena, CA, United States)
Beinsford, Daniel F. (California Inst. of Tech. Pasadena, CA, United States)
Date Acquired
August 27, 2013
Publication Date
February 1, 2013
Publication Information
Publication: NASA Tech Briefs, Februrary 2013
Subject Category
Man/System Technology And Life Support
Report/Patent Number
NPO-47306
Distribution Limits
Public
Copyright
Public Use Permitted.

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