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Flexible Microstrip Circuits for Superconducting ElectronicsFlexible circuits with superconducting wiring atop polyimide thin films are being studied to connect large numbers of wires between stages in cryogenic apparatus with low heat load. The feasibility of a full microstrip process, consisting of two layers of superconducting material separated by a thin dielectric layer on 5 mil (approximately 0.13 mm) Kapton sheets, where manageable residual stress remains in the polyimide film after processing, has been demonstrated. The goal is a 2-mil (approximately 0.051-mm) process using spin-on polyimide to take advantage of the smoother polyimide surface for achieving highquality metal films. Integration of microstrip wiring with this polyimide film may require high-temperature bakes to relax the stress in the polyimide film between metallization steps.
Document ID
20130014515
Acquisition Source
Headquarters
Document Type
Other - NASA Tech Brief
Authors
Chervenak, James
(NASA Goddard Space Flight Center Greenbelt, MD, United States)
Mateo, Jennette
(SB Microsystems Columbia, MD, United States)
Date Acquired
November 26, 2013
Publication Date
December 1, 2013
Publication Information
Publication: NASA Tech Briefs, December 2013
Subject Category
Electronics And Electrical Engineering
Man/System Technology And Life Support
Report/Patent Number
GSC-16718-1
Distribution Limits
Public
Copyright
Public Use Permitted.
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