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Modular Integrated Stackable Layers (MISL) 1.1 Design SpecificationThis document establishes the design guideline of the Modular Instrumentation Data Acquisition (MI‐DAQ) system in utilization of several designs available in EV. The MI‐ DAQ provides the options to the customers depending on their system requirements i.e. a 28V interface power supply, a low power battery operated system, a low power microcontroller, a higher performance microcontroller, a USB interface, a Ethernet interface, a wireless communication, various sensor interfaces, etc. Depending on customer's requirements, the each functional board can be stacked up from a bottom level of power supply to a higher level of stack to provide user interfaces. The stack up of boards are accomplished by a predefined and standardized power bus and data bus connections which are included in this document along with other physical and electrical guidelines. This guideline also provides information for a new design options. This specification is the product of a collaboration between NASA/JSC/EV and Texas A&M University. The goal of the collaboration is to open source the specification and allow outside entities to design, build, and market modules that are compatible with the specification. NASA has designed and is using numerous modules that are compatible to this specification. A limited number of these modules will also be released as open source designs to support the collaboration. The released designs are listed in the Applicable Documents.
Document ID
20140004236
Acquisition Source
Johnson Space Center
Document Type
Other
Authors
Yim, Hester J. (NASA Johnson Space Center Houston, TX, United States)
Date Acquired
April 30, 2014
Publication Date
April 30, 2012
Subject Category
Electronics And Electrical Engineering
Computer Systems
Report/Patent Number
JSC-CN-30143
MISL1D000S-1.1
Distribution Limits
Public
Copyright
Work of the US Gov. Public Use Permitted.

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