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Embedded Thermal Control for Spacecraft Subsystems MiniaturizationOptimization of spacecraft size, weight and power (SWaP) resources is an explicit technical priority at Goddard Space Flight Center. Embedded Thermal Control Subsystems are a promising technology with many cross cutting NSAA, DoD and commercial applications: 1.) CubeSatSmallSat spacecraft architecture, 2.) high performance computing, 3.) On-board spacecraft electronics, 4.) Power electronics and RF arrays. The Embedded Thermal Control Subsystem technology development efforts focus on component, board and enclosure level devices that will ultimately include intelligent capabilities. The presentation will discuss electric, capillary and hybrid based hardware research and development efforts at Goddard Space Flight Center. The Embedded Thermal Control Subsystem development program consists of interrelated sub-initiatives, e.g., chip component level thermal control devices, self-sensing thermal management, advanced manufactured structures. This presentation includes technical status and progress on each of these investigations. Future sub-initiatives, technical milestones and program goals will be presented.
Document ID
20140005429
Acquisition Source
Goddard Space Flight Center
Document Type
Presentation
Authors
Didion, Jeffrey R. (NASA Goddard Space Flight Center Greenbelt, MD United States)
Date Acquired
May 9, 2014
Publication Date
March 25, 2014
Subject Category
Fluid Mechanics And Thermodynamics
Report/Patent Number
GSFC-E-DAA-TN13750
Meeting Information
Meeting: Spacecraft Thermal Control Workshop
Location: El Segundo, CA
Country: United States
Start Date: March 25, 2014
End Date: March 27, 2014
Sponsors: Aerospace Corp.
Distribution Limits
Public
Copyright
Work of the US Gov. Public Use Permitted.
Keywords
Thermal Control
0000
Spacecraft Systems

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