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1st NASA Electronic Parts Packaging (NEPP) Program Electronic Technology Workshop (ETW)NEPP supports all of NASA for >20 years - 7 NASA Centers and JPL actively participate The NEPP Program focuses on the reliability aspects of electronic devices - Three prime technical areas: Parts (die), Packaging, and Radiation Alternately, reliability may be viewed as: -
Document ID
20180001155
Acquisition Source
Goddard Space Flight Center
Document Type
Presentation
Authors
LaBel, Kenneth A. (NASA Goddard Space Flight Center Greenbelt, MD, United States)
Sampson, Michael J. (NASA Goddard Space Flight Center Greenbelt, MD, United States)
Date Acquired
February 13, 2018
Publication Date
May 17, 2010
Subject Category
Space Radiation
Electronics And Electrical Engineering
Report/Patent Number
LEGNEW-OLDGSFC-GSFC-LN-1195
Meeting Information
Meeting: JEDEC Solid State Technology Association JC-13 Meeting
Location: Nashville, TN
Country: United States
Start Date: May 17, 2010
End Date: May 21, 2010
Sponsors: JEDEC Solid State Technology Association
Distribution Limits
Public
Copyright
Work of the US Gov. Public Use Permitted.

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