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Lab-on-chip for testing thin film materials: extraction of mechanical and electrical properties under large deformation at the nanometer scale
Primary tabs
| Document type | Communication à un colloque (Conference Paper) – Présentation orale avec comité de sélection |
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| Publication date | 2016 |
| Language | Anglais |
| Conference | "Third Winfab Scientific Day", UCL, Louvain-la-Neuve (Belgium) (29/01/2016) |
| Publication status | Publié |
| Affiliations |
UCL
- SST/ICTM/ELEN - Pôle en ingénierie électrique UCL - SST/IMMC/IMAP - Materials and process engineering |
| Links |
| Bibliographic reference | Coulombier, Michaël ; Raskin, Jean-Pierre ; Pardoen, Thomas. Lab-on-chip for testing thin film materials: extraction of mechanical and electrical properties under large deformation at the nanometer scale.Third Winfab Scientific Day (UCL, Louvain-la-Neuve (Belgium), 29/01/2016). |
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| Permanent URL | http://hdl.handle.net/2078.1/241111 |