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Effect of Heat Sink in Back-End of Line on Self-Heating in 22 nm FDSOI MOSFETs
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Halder, Arka
[UCL]
Nyssens, Lucas
[UCL]
Rack, Martin
[UCL]
Raskin, Jean-Pierre
[UCL]
Kilchytska, Valeriya
[UCL]
Raskin, Jean-Pierre
[UCL]
Kilchytska, Valeriya
[UCL]
| Document type | Communication à un colloque (Conference Paper) – Présentation orale avec comité de sélection |
|---|---|
| Access type | Accès libre |
| Publication date | 2020 |
| Language | Anglais |
| Conference | "2020 Joint International EUROSOI Workshop and International Conference on Ultimate Integration on Silicon (EUROSOI-ULIS)", Caen, France (du 1/9/2020 au 30/9/2020) |
| Peer reviewed | yes |
| Host document | "Proceedings"- p. 1-4 (ISBN : 978-1-7281-8765-5) |
| Publication status | Publié |
| Affiliation | UCL - SST/ICTM/ELEN - Pôle en ingénierie électrique |
| Links |
| Bibliographic reference | Halder, Arka ; Nyssens, Lucas ; Rack, Martin ; Raskin, Jean-Pierre ; Kilchytska, Valeriya. Effect of Heat Sink in Back-End of Line on Self-Heating in 22 nm FDSOI MOSFETs.2020 Joint International EUROSOI Workshop and International Conference on Ultimate Integration on Silicon (EUROSOI-ULIS) (Caen, France, du 1/9/2020 au 30/9/2020). In: Proceedings, 2020, p. 1-4 |
|---|---|
| Permanent URL | http://hdl.handle.net/2078.1/269248 |